Chipbond Technology Corp.
| Gretai Securities Market: 6147
Chipbond Technology Corp. engages in the development, manufacture, and sale of electronic and semiconductor products. Its services include turnkey, bumping manufacturing, redistribution layer, wafer surface processing, wafer grinding, dicing and pick and place, package and test, and final inspection and failure analysis services. The company was founded on June 11, 1997 and is headquartered in Hsinchu City, Taiwan.