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Intel Corp.

Intel Corp.

Sector: Semiconductors And Related Devices Region: CA, United States


: | Euronext Amsterdam: INCO | Hong Kong Stock Exchange: 4335 | SIX Swiss Exchange: INTC | XETRA: INL | Mexican Stock Exchange: INTC | Nasdaq: INTC


Similar to: Diodes, Inc., Cirrus Logic, Inc., Fairchild Semiconductor International, Inc.

Intel Corp. designs, manufactures and sells computer components and related products. It designs and manufactures computing and communication components, such as microprocessors, chipsets, motherboards, and wireless and wired connectivity products. The company develops advanced integrated digital technology products, primarily integrated circuits, for industries such as computing and communications. It also develops platforms, which it defines as integrated suites of digital computing technologies that are designed and configured to work together to provide an optimized user computing solution. The company operates its business through five segments: PC Client Group, Data Center Group, Other Intel Architecture Group, Software & Services, Intel Mobile Communications, Intelligent Systems Group, Netbook and Tablet Group, Ultra-Mobility Group, McAfee, Wind River Software Group, Non-Volatile Memory Solutions Group. The PC Client Group offers products that are incorporated into notebook platforms and desktop computers for consumers and business like microprocessors and related chipsets and motherboards, which are designed for the notebook and desktop (including high-end enthusiast PCs) market segments; and wireless connectivity products. The Data Center Group offers products that provide leading performance, energy efficiency, and virtualization technology for server, workstation, and storage platforms. It delivers microprocessors and related chipsets and motherboards, which are designed for the server, workstation, and storage computing market segments; and wired network connectivity products. The Other Intel Architecture Group offer products that are designed for use in the mobile communications, embedded, netbook, tablet, and smart phones. The Intel Mobile Communications segment provides mobile phone components, such as baseband processors, radio frequency transceivers, and power management chips. Intelligent Systems Group delivers microprocessors and related chipsets for embedded applications. The Netbook & Tablet Group delivers microprocessors and related chipsets for the netbook and tablet market segments. The Ultra-Mobility Group delivers low-power Intel architecture-based products in the next-generation handheld market segment. The Software & Services Group consists of the three sub-operating groups: McAfee, Wind River Software Group and Software & Services Group. The McAfee Group, is operated by the company's wholly-owned subsidiary, McAfee, Inc., delivers software products for endpoint security, system security, consumer security, network security, and risk and compliance. The Wind River Software Group, operated by the company's wholly-owned subsidiary, Wind River Systems, Inc., develops and licenses embedded and mobile device software products, including operating systems, virtualization technologies, middleware, and development tools. The Software and Services Group delivers software products and services that promote Intel Architecture as the platform of choice for software development. The Non-Volatile Memory Solutions Group delivers NAND flash memory products for use in solidstate drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The company was founded by Robert Norton Noyce and Gordon Earle Moore in 1968 and is headquartered in Santa Clara, CA.

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Executives

Brian M. Krzanich , Chief Executive Officer
Brian M. Krzanich was appointed chief executive officer of Intel Corporation and elected a member of the board of directors on May 16, 2013. He is the sixth CEO in the company's history, succeeding Paul S. Otellini.
Krzanich has progressed through a series of technical and leadership roles at Intel, most recently serving as the chief operating officer (COO) since January 2012. As COO, his responsibilities included leading an organization of more than 50,000 employees spanning Intel's Technology and Manufacturing Group, Intel Custom Foundry, supply chain operations, the NAND Solutions group, human resources, information technology and Intel's China strategy.
His open-minded approach to problem solving and listening to customers' needs has extended the company's product and technology leadership and created billions of dollars in value for the company. In 2006, he drove a broad transformation of Intel's factories and supply chain, improving factory velocity by more than 60 percent and doubling customer responsiveness. Krzanich is also involved in advancing the industry's transition to lower cost 450mm wafer manufacturing through the Global 450 Consortium as well as leading Intel's strategic investment in lithography supplier ASML.
Prior to becoming COO, Krzanich held senior leadership positions within Intel's manufacturing organization. He was responsible for Fab/Sort Manufacturing from 2007-2011 and Assembly and Test from 2003 to 2007. From 2001 to 2003, he was responsible for the implementation of the 0.13-micron logic process technology across Intel's global factory network. From 1997 to 2001, Krzanich served as the Fab 17 plant manager, where he oversaw the integration of Digital Equipment Corporation's semiconductor manufacturing operations into Intel's manufacturing network. The assignment included building updated facilities as well as initiating and ramping 0.18-micron and 0.13-micron process technologies. Prior to this role, Krzanich held plant and manufacturing manager roles at multiple Intel factories.
Krzanich began his career at Intel in 1982 in New Mexico as a process engineer. He holds a bachelor's degree in Chemistry from San Jose State University and has one patent for semiconductor processing. Krzanich is also a member of the board of directors of the Semiconductor Industry
David Perlmutter, Executive Vice President General Manager, Intel Architecture Gro
David (Dadi) Perlmutter is executive vice president, general manager of the Intel Architecture Group (IAG) and chief product officer of Intel Corporation. He is responsible for Intel's platform solutions for all computing segments including datacenters, desktops, laptops, handhelds, embedded devices, and consumer electronics.
Prior to his current role, Perlmutter was senior vice president and general manager of the Mobility Group, where he drove the creation of Intel's latest mobile products from the high-performance Intel® Core™ processor family to the low-power Intel® Atom™ processor family which enabled the netbook segment and allowed Intel to enter the ultra-low power handheld market. As vice president and general manager of the Mobile Platforms Group, he developed the first Intel® Centrino® brand processor technology, which grew the mobile business and became the foundation for all future mobile products. Previously, Perlmutter was vice president, Microprocessor Products Group, and general manager, Basic Microprocessor Division as well as the manager of the Intel Israel Development Center in Haifa, where he led the development of the Intel® Extended Temperature Pentium® processor with MMX™ technology and its mobile versions as well as other products. Perlmutter also led the development teams that designed the Intel® i387™ math coprocessor and the Intel® i860™ XP RISC processor that defined the initial direction for the Pentium processor microarchitecture. As general manager of the Microprocessor Division, he was responsible for the design, development and marketing of the Intel® Pentium® Pro and the Intel® Pentium® II processors.
Perlmutter joined Intel in 1980 after graduating from the Technion, Israel Institute of Technology, with a B.Sc. in Electrical Engineering. He holds patents on branch target buffers and multiprocessing cache coherency protocols. Perlmutter received an award for innovation in industrial development from the Israeli president in 1987 for the development of the i387 math coprocessor. Perlmutter was elected a Fellow of the Institute of Electrical and Electronics Engineers for his contributions to the mobile personal computer industry.
Stacy J. Smith , Executive Vice President Chief Financial Officer
Stacy J. Smith is executive vice president and chief financial officer (CFO) for Intel Corporation. In this role, he is responsible for leading the worldwide finance organization, and overseeing finance, accounting and reporting, tax, treasury, internal audit, and investor relations.
Smith joined Intel in 1988 and has held positions in Finance, Sales and Marketing, and Information Technology. In March of 2006 he was appointed assistant chief financial officer. He has also held the position of chief information officer where he was responsible for Intel's Information Technology Group. He was the general manager of Intel Europe, Middle East and Africa (EMEA) where he was responsible for Intel product sales and marketing in the EMEA region. Smith became vice president of Sales and Marketing in 2002. Over the years, he has held Finance positions in various divisions, Components Manufacturing, Systems Manufacturing, and Sales and Marketing. He has been located with Intel in the US, Asia, Europe, and Latin America.
Smith is a graduate from the University of Texas where he earned his MBA degree in Finance in 1988. He also serves on the board of directors of Autodesk Inc., a 3-D design, engineering and entertainment software company, and Gevo, a renewable chemicals and advanced biofuels company.

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